SEMATECH’s 3D R&D center will utilize the GDM300 backgrinder for their TSV development

Nanotechnology Now – ALBANY, NY | Posted on September 17th, 2009

Okamoto announced today that SEMATECH, the global consortium of chip-makers, has selected Okamoto’s GDM300 Backgrinder for processing Through Silicon Via (TSV). The System, a High-Precision wafer thinning tool, will be installed in SEMATECH’s 3D

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