![Okamoto Dealer Meeting 2015 Okamoto Dealer Meeting 2015](http://www.okamotocorp.com/wp-content/uploads/bfi_thumb/dummy-transparent-pje91bkp1xyhymemvfkh4i7n2trwtvnvybt3vc47gi.png)
![Okamoto Dealer Meeting 2015 Okamoto Dealer Meeting 2015](http://www.okamotocorp.com/wp-content/uploads/bfi_thumb/dummy-transparent-pje91bkp1xyhymemvfkh4i7n2trwtvnvybt3vc47gi.png)
SEMATECH’s 3D R&D center will utilize the GDM300 backgrinder for their TSV development
Nanotechnology Now – ALBANY, NY | Posted on September 17th, 2009
Okamoto announced today that SEMATECH, the global consortium of chip-makers, has selected Okamoto’s GDM300 Backgrinder for processing Through Silicon Via (TSV). The System, a High-Precision wafer thinning tool, will be installed in SEMATECH’s 3D
![Open House Open House](http://www.okamotocorp.com/wp-content/uploads/bfi_thumb/dummy-transparent-pje91bkp1xyhymemvfkh4i7n2trwtvnvybt3vc47gi.png)